Featuring an advanced cleanroom robot, this system enables high - speed transport without the need for a linear motion axis. It offers seamless compatibility with 150mm, 200mm, and 300mm substrates, accommodating both transparent and non - transparent wafers. A handheld controller comes as standard equipment.
Users have the flexibility to choose between a standard model and a highly customized version tailored to specific requirements. Regarding wafer handling, multiple options are available, including O - RING, vacuum, and Edge Clamp methods. Additionally, optional add - on modules such as FFU (Fan Filter Unit), ion bars, and buffer systems can be integrated. The LOAD PORT can be specified to support N2 or XCDA purge environments, providing enhanced process adaptability.
| Wafer Size | SEMI Standard 200mm - 300mm Wafers |
| Throughput (with Dual-arm Robot) | 550 WPH (without OCR and Aligner) |
| 100 WPH (with OCR and Aligner) |
| 60 WPH (with OCR and Aligner for thin/transparent wafers) |
| End Effector | Vacuum Type or Clamping Type |
| Robot Repeatability Precision | ±0.1mm |
| Buffer Repeatability Precision | ±0.1mm |
| Mean Time to Repair (MTTR) | < 2 hours |
| Mean Time Between Failures (MTBF) | 2000H or > 4000H |
| Communication Target | Standard Communication Protocol / Optional SECS / Optional GEM Communication Protocol |
| Vacuum Requirement | -90kPa (minimum) |
| OS | Windows 10/11/XP Professional or Compatible |
| Cleanliness Class | Class 100 - Class 1 |
| Equipment Requirements | 220 V, 50/60 Hz, 15A, 3 wires, Single-phase |
